PEOPLE

Training of postdocs and visiting scholars:

*15 of them have been hired as regular faculty members in universities and Chinese Academy of Sciences (3 in Peking University, 1 in USTC, 2 in UESTC, 2 in Southeast Univ., 1 in Xidian Univ., 1 in Southern University of Science and Technology, 1 in Beihang University, 1 in Shenzhen University, and 2 in Chinese Academy of Sciences, etc.)

Postdocs (25 in total):

  • Dr. Liuqing Gao, Postdoc (2023-present) (Ph.D., University of Illinois at Urbana-Champaign, USA)
  • Dr. Yangming Du, Postdoc (2023-present) (Ph.D., The University of Sheffield, UK)
  • Dr. Jiahui Sun, Postdoc (2022-present) (Ph.D., HKUST)
  • Dr. Gang Lyu, Postdoc (2018-2022) (Ph.D., Tsinghua University), Associate Professor at Beihang University, Beijing, China
  • Dr. Zheyang Zheng, Postdoc (2021-2022) (Ph.D., HKUST), Research Assistant Professor at HKUST, HKSAR, China
  • Dr. Jie Zhang, Postdoc (2019-2021) (Ph.D., Peking University), Research Fellow at Fudan University, Shanghai, China
  • Dr. Long Zhang, Postdoc (2018-2019) (Ph.D., Southeast University), Associate Professor at Southeast University, Nanjing, China
  • Dr. Jin Wei, Postdoc (2018-2019) (Ph.D., Hong Kong University of Science and Technology), assistant professor in Peking University, Beijing, China
  • Dr. Mengyuan Hua, Postdoc (2017-2018) (Ph.D., Hong Kong University of Science and Technology), assistant professor at Southern University of Science and Technology, Shenzhen, China
  • Dr. Qilong Bao, Postdoc (2016-2017) (Ph.D., Institute of Microelectronics, Chinese Academy of Sciences), currently at Huawei, Shanghai
  • Dr. Baikui Li, Postdoc (2012-2014) (Ph.D., Hong Kong University of Science and Technology), currently an assistant professor at Shenzhen University
  • Dr. Sen Huang, Postdoc (2009-2012) (Ph.D., Peking University), currently a professor at Institute of Microelectronics, Chinese Academy of Science
  • Dr. Peng Liu, Postdoc (2011-2012) (Ph.D., Institute Néel, Centre National de la Recherche Scientifique (CNRS), Grenoble, FRANCE), currently a research scientist in Peking University
  • Dr. Junxue Fu, Postdoc (2009-2010) (Ph.D., University of Georgia), now a research assistant professor in Hong Kong Baptist University
  • Dr. Baoxing Duan, Postdoc (2009-2010) (Ph.D., University of Electronic Science and Technology, China). Now a professor at Xidian University, Xi’an, China
  • Dr. Maojun Wang, Postdoc (2007-2009) (Ph.D, Peking University). Now an associate professor at Peking University, Beijing, China
  • Dr. Wanjun Chen, Postdoc (2007-2009) (Ph.D, University of Electronic Science and Technology, China). Now a professor at University of Electronic Science and Technology, Chengdu, China
  • Dr. Wei Huang, Postdoc (2006-2007) (Ph.D, Peking University). He is now an associate professor at Fudan University, China.
  • Dr. Congshun Wang, postdoc (2006-2007) (Ph.D, Peking University), now a research associate with Boston University.
  • Dr. Zhiqun Cheng, Postdoc, (2003-2005) (Ph.D, Shanghai Institute of Microsystems and Information Technologies, Chinese Academy of Science), now Professor, Hangzhou Dian Zi University.
  • Dr. Yong Cai, Postdoc (2003-2006) (Ph.D, Peking Univ.), now a professor with Suzhou Institute of Nano-tech and Bionics, Chinese Academy of Science.
  • Dr. Zhenchuan Yang, Postdoc (2004-2006) (Ph.D, Peking Univ.), now a Professor, Institute of Microelectronics, Peking University.
  • Dr. Deliang Wang, Postdoc (2003-2005), now a Professor, University of Science and Technology, China.
  • Dr. Lijie Cui, Postdoc (2003-2004), now a research scientist with Institute of Semiconductors, Chinese Academy of Science.
  • Dr. Xiaoping Liao, Postdoc (2001-2003) (Ph.D., Southeast University, China), now Professor, Dept. of EE, Southeast University, Nanjing, China.

Research Assistants:

  • Chenyue Ma (2009-2010), now with ASTRI, Hong Kong
  • Jinwen Zhang (2002-2004), now a Professor, Institute of Microelectronics, Peking University.
  • Xiaohua Wang (2007-2008), now a Professor, University of Electronic Science and Technology, China, Chengdu, China
  • Yanbin Shi (2008-2009), received Ph.D in University of Wisconsin, Madison, USA, currently with Microsoft
  • Guofu Niu (1996-1997, at City Univ. of Hong Kong), now professor, Department of Electrical and Computer Engineering, Auburn University, Alabama, USA. 
  • Bin Zhang (1997-1998, at City Univ. of Hong Kong), now an engineer at an IT company in Shenzhen, China.

Education and student mentorship:

  • Student Supervision:
  • Ph.D. and M. Phil. students currently under supervision:
    • Tao Chen, Ph.D. student (B.S., UESTC)
    • Sirui Feng, Ph.D student (B.S. and M.S., Zhejiang University)
    • Yan Cheng, Ph.D. student (B.S., Nanjing University), awardee of HKPFS
    • Hang Liao, Ph.D. student (B.S. and M.S., UESTC)
    • Yat Hon Ng, Ph.D. student (B.S, Southampton, UK)
    • Junting Chen, Ph.D. student (B.S., South University of Science and Technology)
    • Ji Shu, Ph.D. student (B.S. and M.S., Sichuan University)
    • Yutao Geng, Ph.D. student (B.S., UESTC)
    • Yingchen Yang, Ph.D student (B.S. and M.S., Zhejiang University), awardee of HKPFS
    • Yichen Liu, Ph.D student (B.S., UESTC)
    • Yumeng Huang, Ph.D student (B.S., UESTC)
    • Heng Wang, Ph.D student (B.S. and M.S., Shandong Univ.)
    • Binghong Wang, Ph.D student (B.S., HKUST)
  • Ph.D students graduated: (32 in total, 6 faculty members in universities)
    • Jiahui Sun, Ph.D. (2022) (B.S., Xi’an Jiao Tong Univ. and M.Sc. Zhejiang Univ.), currently a postdoctoral fellow at HKUST
    • Li Zhang, Ph.D. (2022) (B.S. and M.Sc. Xidian Univ.), currently with Silergy Corp. Hong Kong
    • Wenjie Song, Ph. D. (2022) (B. S. Xian Jiaotong University). Currently with San’an Integration, Xiamen, China 
    • Han Xu, Ph. D. (2022) (B. S. University of Electronic Science and Technology of China). Currently with San’an Integration, Xiamen, China 
    • Kailun Zhong, Ph. D. (2022) (B. S. University of Electronic Science and Technology of China). Currently with Navitas Semiconductors, USA. 
    • Zheyang Zheng, Ph. D. (2021) (B. S. Zhejiang University). Currently with HKUST, Hong Kong, China. 
    • Song Yang, Ph. D. (2020) (B. S. Xi’an Jiaotong University, China). Currently with Huawei Technologies, Shenzhen, China. 
    •  Yuru Wang, Ph. D. (2020) (B. S. and M.S., University of Electronic Science and Technology of China). Currently with Huawei Technologies, Shenzhen, China. 
    •  Jiabei He, Ph. D. (2020) (B. S. Nankai University, China). Currently with HiSilicon, Shenzhen, China. 
    • Jiacheng Lei, Ph. D. (2019) (B. S. University of Electronic Science and Technology, China, Chengdu). Currently with Globalfoundries Inc. Singapore. 
    • Gaofei Tang, Ph. D. (2018) (B. S. University of Electronic Science and Technology, China, Chengdu). Currently with Huawei Technologies, Shenzhen, China. 
    • Qingkai Qian, Ph. D. (2018) (B. S. and M. Sc. Tsinghua University). Currently a postdoctoral fellow, Penn State University, US.
    • Zhaofu Zhang, Ph. D. (2018) (B. S. Nankai University). Currently a postdoctoral fellow, Cambridge University, UK.
    • Ruiliang Xie, Ph. D. (2018) (B. S. and M. Sc., Xi’an Jiao Tong University). Currently with State Grid of China, Beijing, China.
    • Mengyuan Hua, Ph. D. (2017) (B. S. Tsinghua University). Currently an assistant professor, Southern University of Science and Technology, Shenzhen, China.
    • Jin Wei, Ph. D. (2017) (B. S. Sun Yat-san University, M. S. University of Electronic Science and Technology), as an assistant professor in Peking University, Beijing.
    • Xi Tang, Ph. D. (2016) (B. S. Nanjing University, M. S. Cornell University). Professor, Anhui University, Hefei, China.
    • Hanxing Wang, Ph. D. (2016) (B. S. Zhejiang University). Currently with Huawei Technologies, Shenzhen, China. 
    • Shenghou Liu, Ph. D. (2016) (B. S. Xidian University, M. S. Peking University). Currently with Xiamen San’an Integrated Circuits Co., Ltd. Xiamen, China. 
    • Cheng Liu, Ph. D. (2016) (B. S., M. S. Huazhong University of Science and Technology), Currently with Xiamen San’an Integrated Circuits Co., Ltd. Xiamen, China.
    •  Yunyou Lu, Ph.D. (2015) (B.S., Tsinghua University). First employed at DJI, Shenzhen, China. Now with Intel, USA.
    • Qimeng Jiang, Ph.D. (2014) currently employed at HiSilicon, Shen Zhen, China.
    • Zhikai Tang, Ph.D. (2014) currently employed at EPC (Efficient Power Conversion), El Segundo, CA, USA.
    • Shu Yang, Ph.D. (2014) currently a professor (and 1000 Young Talents， 青年千人) at Zhejiang University.
    • Alex Man Ho Kwan, Ph.D. (2013) currently employed at TSMC, Hsinchu, Taiwan.
    • Hongwei Chen, Ph.D. (2012) “Fabrication Technology and Device Simulation of Enhancement-mode AlGaN/GaN Transistors” deceased.  
    • Chunhua Zhou, Ph.D. (2012) “Performance Enhancement and Characterization Techniques for GaN-on-Si Power Devices” First employed at Efficient Power Conversion (EPC) Corp., USA, now VP of engineering in InnoScience Technology Corporation Ltd., Zhuhai, China (青年千人). Also, a professor at School of Microelectronics, University of Electronic Science and Technology, China (UESTC).
    • Qi Zhou, Ph.D. (2012) “Schottky Source/Drain and High-K Gate Dielectric Technologies for High Performance InAlN/GaN Heterojunction Devices” He is currently a professor in School of Microelectronics, University of Electronic Science and Technology, China (UESTC).
    • Li Yuan, Ph. D (2011) “Process Modeling and Device Technology for GaN Normally-off Power Transistors” First employed at Institute of Microelectronics, A*STAR, Singapore. Currently employed as CEO of Genettice Limited, Qingdao, China
    • King Yuen Wong (Ph.D. 2009) “Device Technologies for GaN-Based Sensing and Control ICs” Currently VP of R&D, InnoScience Technology Corporation Ltd., Zhuhai, China. First employment at Taiwan Semiconductor Manufacturing Corporation (TSMC), Hsinchu, Taiwan. Now VP of Engineering, InnoScience (Zhuhai) Technology Corp., China.
    • Ruonan (Reynold) Wang (Ph.D. 2008) “Enhancement/Depletion-mode HEMT Technology for III-Nitride Mixed-Signal and RF Applications,” Currently employed at Intel Corp. Shenzhen, China.
    • Hualiang (Bruce) Zhang (Ph.D. 2007) “Compact, Reconfigurable and Dual-band Microwave Circuits,” Currently employed at Department of Electrical Engineering, University of Massachusetts (Lowell) as an associate professor.
    • Jie Liu (Ph.D. 2006) “Channel Engineering of III-Nitride HEMTs for Enhanced Device Performance,” Currently employed at General Electric Healthcare Division, Beijing, China.
    • Lydia Lap Wai Leung (Ph.D. 2005) “Low-loss On-Chip Interconnects for Silicon Integrated Radio-Frequency and Microwave Systems,” Currently CEO of Belun Technology, Hong Kong.
  • Master of Philosophy students graduated: (13 in total)
    • Kenneth K. P. Tsui, “RF Characterization and Modeling of MOSFET Power Amplifier in Wireless Communication,” M. Phil， August 2003. Now with IDT International Ltd. Hong Kong.
    • Rongming Chu, “AlGaN-GaN Single- and Double-channel High Electron Mobility Transistors,” M. Phil, August 2004. Received his Ph.D from University of California at Santa Barbara under Prof. Umesh Mishra in 2008. Now an associate professor at Penn State University, USA.
    • Cheong Wai Hon, “CMOS-Compatible High-Performance Micromachined Edge-Suspended Inductors,” M. Phil, June 2004. Now with Bank of East Asia, Hong Kong.
    • Kwong Fu Chan, “Large-signal Characterization/Modeling and Linearization Techniques for RF Power Amplifiers,” M. Phil, August 2004. Now with ICAC (The Independent Commission Against Corruption), Hong Kong Government.
    • William Chun San Chu, “On-Chip Passive Components for GaN-based RFIC/MMIC Applications,” M. Phil, August 2005. Now with ICAC (The Independent Commission Against Corruption), Hong Kong Government.
    • Shuo Jia, “AlGaN/GaN High Electron Mobility Transistors on Silicon Substrate for RF/Microwave Applications,” M. Phil, August 2005. Now with Radio Network R&D center, Ericsson (Beijing).
    • Yichao Wu, “RF Circuit Applications for Enhancement-mode AlGaN/GaN HEMTs,” M. Phil. August 2007. Now a telecom analyst in Shenzhen, China.
    • Di Song, “III-Nitride Low-Density-Drain High Electron Mobility Transistors (LDD-HEMTs),” M. Phil, August 2007. Now with Nomura Securities, Hong Kong
    • Congwen Yi, “Reliability Study of Enhancement-Mode AlGaN/GaN HEMT Fabricated with Fluorine Plasma Treatment Technology” M. Phil, Aug. 2008. Received Ph.D from Duke University, USA. Now with Apple, USA.
    • Song Tan, “Design of Compact and Dual-Band Microwave Microstrip Balun” M. Phil. Aug. 2008. Currently a Ph.D. student with City University of Hong Kong.
    • Lei Chen, “Dielectric Passication of AlGaN/GaN High Electron Mobility Transistor” M. Phil. Oct. 2010, now with a private equity firm, Shanghai, China.
    • Guan Yue, “GaN-based Temperature Sensing and Over-temperature Protection ICs,” M. Phil (2011), currently with Alibaba, Hong Kong.
    • Xiaosen Liu, “Integrated Circuit Applications of AlGaN/GaN HEMTs and Rectifiers” M. Phil. (2011), received Ph.D from Texas A&M University, now with Intel Corporate Research.